ALINX AMD Xilinx Kintex UltraScale+ XCKU3P FPGA development board

Overview

ALINX AMD Xilinx Kintex UltraScale+ XCKU3P development board AXKU3 KU3P

Product Description

The AXKU5/AXKU3 FPGA development board equipped with the AMD/Xilinx Kintex Ultrascale+™-series device, delivers standout performance with fast DDR4 SDRAM, QSPI Flash, PCIe, FMC HPC, Gigabit Ethernet.

Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), Provide high-speed communication (PCIe).

Applications

● PON Access
● Mobile Backhaul
● Data Center Network Acceleration

Key Features

System-on-Module
● AMD/Xilinx Kintex Ultrascale+™:
◆ 16nm FinFET FPGA fabric
◆ Up to 60% reduction in power consumption compared to 7 Series FPGAs
◆ More than 2x faster system-level performance per watt compared to Kintex 7 FPGAs
● Pluggable module with 2 x Samtec board-to-board connectors
● 2 GByte (32-bit) DDR4 SDRAM
● 2 x 32 MB QSPI Flash
Base Board
● FMC HPC (34 pairs lvds ios + 8 pairs GTH)
● 1 x PCIe® Gen3 ×8
● 1 x Gigabit Ethernet
● 1 x UART (USB to UART)
● 1 x 4 lane MIPI
● 1 x MicroSD
● 1 x 40-pin Expansion Port (40 pin 2.54mm spacing, with 34 IOs, connected to ALINX modules such as binocular cameras, TFT LCD screens, high-speed AD modules, etc.)
● LED (1 x PWR + 1 x RXD + 1 x TXD + 4 x LED) KEY(4 x KEY)
● 12V single supply
● Dimensions: 215 x 111 mm form factor

Product Information

Specifications
What's Inside

Board Features

Featuring the AMD/Xilinx Kintex Ultrascale+™ XCKU3P-2FFVB676I

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Kintex Ultrascale+™ based application.

* The AXKU3 development board consists of a ACKU3 SoM and base board. If you want to purchase ACKU3 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Kintex Ultrascale+™ XCKU3P FPGA development board and Some accessories

The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA devices – it is low-profile and covers the whole XCKU3P device surface.

System-on-Module	1	Base Board	1
Mini USB Cable	1	USB Downloader Cable / set	1
12V Power Adapter	1	PCle Fence	1
Heatsink Kit (preinstalled)	1

Product Selection Matrix

Product Matrix

Product Model	Preferred Model	FPGA Devices	DDR4 SDRAM	QSPI Flash	GTY	USD Price
AXKU3	√	XCKU3P-2FFVB676I	2 GB	2 x 32 MB	16	792
AXKU5	√	XCKU5P-2FFVB676I	2 GB	2 x 32 MB	16	924

1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.

We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.