ALINX AMD Xilinx Zynq 7000 SoC XC7Z035 development board

Overview

AX7350B Development Board & Kit with AMD Zynq™ 7000 SoC XC7Z035 7Z035

Product Description

The AX7350B SoC development board equipped with the AMD/Xilinx Zynq™ 7000 SoC-series XC7Z035 device, delivers standout performance with fast DDR3 SDRAM, eMMC Flash, QSPI Flash, SFP+, FMC LPC, Gigabit Ethernet.

Compatible with a multitude of FMC board (data acquisition, motor control, display camera interfaces, software defined radio), provide high-speed communication interface (SFP+).

Applications

Automotive
● Road Sign Recognition
● ADAS
● Smart Transportation
Communication Network
● Ethernet Backhaul
● Small Cell Baseband
● Network Switch
● Flexible radio platform
Industrial
● Motor control
● Industrial Control
● Industrial IoT
● Instrumentation
● Smart Grid
Video and Image Processing
● Professional Cameras
● Computer Vision
● Machine Vision
Medical
● Endoscop
● Ultrasound, CT, MRI

Key Features

● AMD/Xilinx Zynq™ 7000 SoC:
◆ ARM® dual-core Cortex™-A9 up to 800 MHz
◆ Xilinx Kintex 7 28nm FPGA fabric● 1 GByte (32-bit) DDR3 SDRAM on PS
● 1 GByte (32-bit) DDR3 SDRAM on PL
● 32 MB QSPI Flash
● 8 GB eMMC Flash
● 1 x FMC LPC (FMC has 34 pairs lvds io and 1 pairs GTX)
● 1 x HDMI out
● 2 x SFP+ (per line 10Gbos)
● 2 x Gigabit Ethernet (1 x PS + 1 x PL)
● 4 x USB2.0 (Host)
● 1 x USB to UART on PS
● 1 x PCIe® Gen2 ×4 (PL)
● 1 x JTAG
● 1 x Micro SD
● LED (1 x PWR + 1 x DONE + 1 x RxD + 1 x TxD + PS LED + 4 x PL LED)
● KEY (1 x PS RST + 1 x PS KEY + 4 x PS KEY)
● 12V single supply
● Dimensions: 220 x 125 mm form factor

Product Information

Specifications
What's Inside

Board Features

Featuring the AMD/Xilinx Zynq™ 7000 SoC XC7Z035-2FFG676I

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ 7000 SoC based application.

What's Inside the Box

ALINX AMD Xilinx Zynq™ 7000 SoC XC7Z035 development board and Some accessories

The FAN8060 Heatsink Kit is an optimal cooling solution for FPGA and SoC devices – it is low-profile and covers the whole XC7Z035 device surface.

Development Board	1	Heatsink Kit (preinstalled)	1
Mini USB Cable	2	Transparent protective board	1
12V Power Adapter	1	Card Reader	1
TF Card	1

Product Selection Matrix

Product Matrix

Product Model	Preferred Model	Zynq 7000 SoC	DDR3 SDRAM (PS)	DDR3 SDRAM (PL)	QSPI Flash	eMMC	USD Price
AX7350B	√	XC7Z035-2FFG676I	1 GB	1 GB	32 MB	8GB	687

1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.

We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.