AXRF47

AXRF47 Dev Board & Kit with AMD Zynq™ US+ RFSoC XCZU47DR

The AXRF47 is an integrated RF processing platform featuring AMD's Zynq UltraScale+ RFSoC Gen3 ZU47DR-2FFVE1156I chip with 8-channel 14-bit 5GSPS RF-ADCs, 8-channel 14-bit 9.84GSPS RF-DACs, and heterogeneous ARM+FPGA processing for 5G, radar, and satellite applications.

Unit price

$ 13879

In stock:

>9, ready to ship in 2 workdays

Overview

AXRF47 dev Board & Kit with AMD Zynq™ US+ RFSoC XCZU47DR ZU47DR

Product Description

The AXRF47 development board adopts the AMD Xilinx Zynq UltraScale+ RFSoC Gen3 series ZU47DR FPGA chip, integrating high-performance RF data converters, programmable logic, an ARM Cortex-A53 processing subsystem, and multi-gigabit transceivers. It supports 8-channel 14-bit RF-ADCs with a maximum sampling rate of 5 GSPS, and 8-channel 14-bit RF-DACs with a maximum sampling rate of 9.85 GSPS. The RF interfaces offer wide frequency band support through configurable coupling and conditioning circuits. It provides a comprehensive RF signal chain that maximizes I/O channel density and bandwidth while leveraging heterogeneous processing capabilities for reduced power consumption.


Designed for large-scale MIMO systems, 5G baseband processing, fixed wireless access (FWA), cable TV access, test and measurement (T&M), satellite communications, phased-array radar/digital array radar (DAR), and other high-performance RF applications.

Applications



Key Features

Product Information

Development Board Features

Featuring the AMD/Xilinx's Zynq™ UltraScale+™ RFSoC XCZU47DR-2FFVE1156I Adaptive SoC

Design-in Kit – The Fast Way to the Market, to get started with development straight out of the box.
The ALINX development board help shorten time-to-market for any AMD/Xilinx Zynq™ UltraScale+™ RFSoC based application.

AXRF47 dev Board & Kit with AMD Zynq™ US+ RFSoC XCZU47DR ZU47DR



* The AXRF47 development board consists of a ACRF47 SoM and base board. If you want to purchase ACRF47 SoM separately.
Please check the Relevant Products at the bottom of the page and click to learn more details.

What's Inside the Box

ALINX AMD Xilinx Zynq™ UltraScale+™ RFSoC ZU47DR development board and Some accessories

Heatsink Kit is an optimal cooling solution for ALINX FPGA and SoC modules – it is low-profile and covers the whole module surface.

System-on-Module1Base Board1
Heatsink Kit (preinstalled)112V power supply1
USB to Type-C cable1card reader1
TF card1  


Product Selection Matrix

Product Matrix

Product ModelPreferred ModelFPGA DevicesDDR4 SDRAM (PS)DDR4 SDRAM (PL)QSPI FlashRF-ADCRF-DACGTY                     GTR                     USD Price
AXRF47XCZU47DR-2FFVE1156I4 GB2 GB128 MB888413879


1. For non-preferred models, a minimum order quantity (MOQ) may apply if the products are not in stock.
2. We offer custom configuration, a MOQ applies.
Please contact us for more details.


We offer complete documentations and a lot of demos and tutorials.
Please contact us should you have any need.

Documentations

Related Products

Alinx Electronic Limited 沪ICP备13046728号

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